半导体晶片制造热循环系统
在半导体晶圆制造中实现高产量需要高效的冷却器和热交换器运行，并且需要可靠的冷却器软管和其他密封组件。这些组件必须正确安装、布线和隔热，以实现工艺一致性、可重复性、清洁度和干燥的操作环境。
世伟洛克热循环管理程序旨在防止冷凝并降低运行成本。这项综合程序利用我们数十年的经验和对半导体晶片制造工艺要求的深刻技术理解，提供有助于尽可能提高半导体工序生产率的资源。
热循环解决方案计划的好处
- 通过防止导致工艺中断的冷凝来减少停机时间
- 通过整个工艺循环中的高效介质传输，尽可能地减少热变化，从而提高半导体芯片产量
- 由于改善了冷却器的性能，提高了效率并降低了能源成本
- 由于单一的供应商简化了流程，从而减少了资本支出和运营支出
数百名世伟洛克现场工程师分布在世界各地的授权销售与服务中心，使您能够轻松获得优化半导体晶片制造热循环性能所需的支持。他们为半导体生产需求提供全面的解决方案，包括专家指导、本地支持以及世伟洛克终身有限保证范围内的预设计系统组件。
有关我们的热循环管理计划及其如何帮助您公司的更多信息，请联系您当地的世伟洛克授权的销售与服务中心。
Hose and Flexible Tubing Catalogs
Locate detailed product information, including materials of construction, pressure and temperature ratings, options, and accessories.
内管材料有金属, PTFE, PFA, 乙烯树脂, 尼龙, 聚乙烯和橡胶; 公称软管尺寸 1/8 到 2 in.; 多种英制和公制端接; 可提供定制长度; 可选的外层, 标签和测试
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